LAIRD TECHNOLOGIES

Protect your critical electronic systems from disruptive heat and electromagnetic interference with industry-leading Laird Technologies solutions, available directly through Bossard Americas.

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Empowering High-Performance Engineering with Advanced EMI Shielding and Thermal Management

As electronic assemblies shrink and power densities surge, controlling stray electromagnetic interference (EMI) and excessive heat is essential to preventing system failures. Bossard Americas distributes a comprehensive portfolio of Laird Technologies solutions designed to solve these exact engineering hurdles. Whether you need high-deflection thermal gap fillers or robust microwave absorbers, these components ensure optimal signal integrity, regulatory compliance, and prolonged product lifecycles across automotive, aerospace, medical, and industrial applications.

Key Benefits of Laird

Uncompromised EMI and RFI Suppression

Significantly eliminates stray electromagnetic and radio frequency noise to protect critical data transmission.

Exceptional Mechanical Compliance

Low-hardness gap fillers and flexible gaskets conform effortlessly to irregular surfaces without putting undue stress on sensitive board components.

Harsh-Environment Durability

Built to withstand intense vibration, thermal cycling, and demanding commercial or military operating environments.

Optimized Thermal Pathways

Lowers thermal resistance by eliminating microscopic air gaps, keeping densely packed high-performance electronics cool.

Diverse Material Formulations

Includes highly resilient beryllium copper fingerstocks, Fabric-Over-Foam (FOF) configurations, and advanced silicone-free formulations to prevent outgassing risks.

Streamlined Assembly Integration

Features highly versatile shapes, machinable stocks, and foam-in-place solutions that integrate flawlessly into your existing manufacturing and assembly lines.

Product Types

EMI Shielding Gaskets & Strips

Engineered to deliver exceptional shielding effectiveness, this category features high-performance Fabric-Over-Foam (FOF) gaskets and beryllium copper strips that seal enclosure joints against signal leakage.

ECCOSORB® Microwave Absorbers

Industry-standard ECCOSORB® broadband microwave absorbers—available as polyurethane foam sheets, machinable rigid stock, and high-temperature foam-in-place liquid catalysts—designed to attenuate unwanted high-frequency resonances.

Conductive Sheets

Highly durable, electrically conductive shielding sheets designed for grounding and severe environmental sealing across both commercial and military applications.

Thermal Management Products

Advanced thermal interface materials and gap fillers that bridge the space between heat-generating semiconductor components and cooling hardware to optimize heat dissipation.

Grounding Contacts & Board-Level Shielding

Precision metal stamped components, contacts, and custom shielding frames that provide robust board-level containment of EMI and dependable grounding paths directly on the PCB.