Amphenol

Power your high-performance electronic designs with high-density, reliable interconnect solutions from Amphenol, distributed with rapid delivery and full supply chain support through Bossard North America.

Shop Amphenol

World-Class Interconnect Innovation Meets Precision Distribution

Amphenol ICC delivers state-of-the-art interconnect systems engineered to meet the rigorous bandwidth, power, and environmental demands of modern data management, telecommunications, industrial manufacturing, and automotive applications. Partnering with Bossard provides direct access to trusted Amphenol connector lines—including industry-standard BergStik Hi Temp headers, high-reliability backplane pins, power connectors, and custom wire-to-board solutions—backed by Bossard's inventory management and technical support.

Key Benefits of Amphenol

High-Density Signal Integrity

Engineered to minimize crosstalk and maximize data throughput within compact PCB layouts and space-constrained enclosures.

Harsh-Environment Reliability

Built to withstand severe thermal variations, mechanical shock, and vibration across industrial and automotive environments.

Flexible Architectural Options

Offers customizable modular pitches, right-angle and vertical orientations, and versatile termination styles (SMT, through-hole, press-fit).

High Thermal & Plating Endurance

Features high-temperature housing materials and high-conductivity plating technology to maintain low contact resistance over extended lifespans.

Streamlined Supply Chain Integration

Access Amphenol's extensive product portfolio seamlessly with Bossard’s Smart Factory Logistics and vendor-managed inventory solutions.

Certified Quality Assurance

Fully compliant with ISO 9001 and ISO 14001 standards, ensuring dependable quality and component consistency for high-volume manufacturing.

Product Types

Header & Pin Systems

Versatile board-to-board and wire-to-board headers—including the classic BergStik Pin Header family—offering high temperature tolerance and configurable pin counts for custom stacking heights.

Backplane Interconnects

Scalable backpanel solutions, such as the BERGPIN Back Panel Pin series, engineered for high-density, high-speed backplane routing in data centers and telecom chassis.

Power Distribution Solutions

High-current power connectors and cable-to-board interfaces designed for efficient energy delivery with minimal thermal loss in power-dense server architectures.

Wire-to-Board & Cable Assemblies

Secure, polarized connector housings and terminated cable assemblies featuring positive locking mechanisms for pull-to-release ease and high retention.

High-Speed I/O & Card Edge Connectors

Next-generation high-bandwidth connectors engineered to support extreme data rates across networking switches, storage systems, and computing platforms.